ALEXANDRIA, Va., May 1 -- United States Patent no. 11,970,639, issued on April 30, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).
"Temporary adhesive for wafer processing, wafer laminate and method for producing thin wafer" was invented by Mitsuo Muto (Annaka, Japan), Michihiro Sugo (Annaka, Japan) and Shohei Tagami (Annaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides: a temporary adhesive for wafer processing, said temporary adhesive being used for the purpose of provisionally bonding a wafer to a support, while being composed of a photocurable silicone resin composition that contains a non-functional organopolysiloxane; a wafer processed body; and a method for ...